Chip cleaning machine
We thoroughly clean the wafer with a two-fluid system.
This is a device for cleaning the wafer surface after dicing using two fluids: pure water and air. It controls the re-adhesion of suspended dust with a uniquely developed cleaning cup. It can accommodate various arrangements according to your usage needs. 【Features】 ■ Successful miniaturization of the device by compacting the transport section ■ Thorough cleaning of the wafer using two fluids: pure water and air ■ Contributes to yield improvement
